Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent
1997-04-11
2000-05-23
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
438253, 438255, 438398, 438947, 438964, H01L 218242
Patent
active
060665394
ABSTRACT:
A honeycomb/webbed, high surface area capacitor formed by etching a storage poly using an etch mask having a plurality of micro vias. The etch mask is preferably formed by applying an HSG polysilicon layer on a surface of the storage poly with a mask layer being deposited over the HSG polysilicon layer. An upper portion of the mask layer is removed to expose the uppermost portions of the HSG polysilicon layer and the exposed HSG polysilicon layer portions are then etched, which translates the pattern of the exposed HSG polysilicon layer portions into the storage poly. The capacitor is completed by depositing a dielectric material layer over the storage poly layer and depositing a cell poly layer over the dielectric material layer.
REFERENCES:
patent: 5061650 (1991-10-01), Dennison et al.
patent: 5149676 (1992-09-01), Kim et al.
patent: 5254503 (1993-10-01), Kenny
patent: 5256587 (1993-10-01), Jun et al.
patent: 5278091 (1994-01-01), Fazan et al.
patent: 5292677 (1994-03-01), Dennison
patent: 5340763 (1994-08-01), Dennison
patent: 5340765 (1994-08-01), Dennison et al.
patent: 5342800 (1994-08-01), Jun
patent: 5358888 (1994-10-01), Ahn et al.
patent: 5362666 (1994-11-01), Dennison
patent: 5405799 (1995-04-01), Woo et al.
patent: 5407534 (1995-04-01), Thakur
patent: 5447878 (1995-09-01), Park et al.
patent: 5457063 (1995-10-01), Park
patent: 5459094 (1995-10-01), Jun
patent: 5491356 (1996-02-01), Dennison et al.
patent: 5508223 (1996-04-01), Tseng
patent: 5538592 (1996-07-01), Chen et al.
patent: 5616511 (1997-04-01), Hirota
patent: 5723373 (1998-03-01), Chang et al.
patent: 5744388 (1998-04-01), Chen
patent: 5814549 (1998-09-01), Wu
Clampitt Darwin A.
Green James E.
Jr. Carl Whitehead
Micro)n Technology, Inc.
Thomas Toniae M.
LandOfFree
Honeycomb capacitor and method of fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Honeycomb capacitor and method of fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Honeycomb capacitor and method of fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1836601