High voltage deep trench capacitor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S244000, C438S386000, C257SE27092

Reexamination Certificate

active

07732274

ABSTRACT:
A semiconductor process and apparatus provide a high voltage deep trench capacitor structure (10) that is integrated in an integrated circuit, alone or in alignment with a fringe capacitor (5). The deep trench capacitor structure is constructed from a first capacitor plate (4) that is formed from a doped n-type SOI semiconductor layer (e.g.,4a-c). The second capacitor plate (3) is formed from a doped p-type polysilicon layer (3a) that is tied to the underlying substrate (1).

REFERENCES:
patent: 6107135 (2000-08-01), Kleinhenz et al.
patent: 2006/0240614 (2006-10-01), Tews
patent: 2006/0246670 (2006-11-01), Khemka et al.
C. H. Ng et al., “MIM Capacitor Integration for Mixed-Signal/RF Applications,” IEEE Transactions on Electron Devices, vol. 52, No. 7, Jul. 2005.
H. Sunami et al., “A Corrugated Capacitor Cell (CCC),” IEEE Transactions on Electron Devices, vol. ED-31, No. 6, Jun. 1984.
S. Nakajima et al., “An Isolation-Merged Vertical Capacitor Cell for Large Capacity DRAM,” IEDM 84, 1984.
J. Lützen et al., “Integration of Capacitor for Sub-100-nm DRAM Trench Technology,” 2002 Symposium on VLSI Technology Digest of Technical Papers.
K. P. Muller et al., “Trench Storage Node Technology for Gigabit DRAM Generations,” IEDM 1996.

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