Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1982-03-15
1984-03-27
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430192, 430193, 430166, 430309, 430310, 430311, 430315, 430318, 430330, 430326, G03F 708, G03C 500, B05D 302
Patent
active
044395167
ABSTRACT:
This invention is for a photoresist capable of withstanding temperatures in excess of 200.degree. C. without image distortion. The photoresist comprises a high temperature diazo sensitizer, preferably an ester or amide of an o-quinone diazide sulfonic or carboxylic acid chloride, in a binder comprising a polyvinyl phenol. The sensitizer and polyvinyl phenol react with each other at elevated temperature. The sensitizer has a secondary decomposition temperature and the polyvinyl phenol has a flow temperature at least equal to the temperature where reaction between the two occurs.
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Anon, "Microposit.TM. MF 314 Developer", Shipley Co., Inc. 4 pp., 2/1982.
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De Forest, "Photoresist Material and Processes", pp. 244-246, McGraw Hill Book Co., 1975.
Cernigliaro George J.
Shipley Charles R.
Bowers Jr. Charles L.
Shipley Company Inc.
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