High sputter, etch resistant window for plasma processing chambe

Details High sputter, etch resistant window for plasma processing chambe High sputter, etch resistant window for plasma processing chambe

1998-06-23

2000-06-13

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118715, 118723I, C23C 1600

Patent

active

060745169

ABSTRACT:
A window of a plasma processing chamber. The window includes a first dielectric portion having a first electrical thickness and a first resistivity to an etching plasma that is formed within the plasma processing chamber. There is further included a second dielectric portion disposed within the first dielectric portion. The second dielectric portion has a second electrical thickness that is less than the first electrical thickness. The second dielectric portion is formed of a substantially transparent material and has a second resistivity to the etching plasma. The second resistivity is higher than the first resistivity.

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