Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1994-01-04
1995-02-07
Martin, Roland
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430326, 430328, G03C 500
Patent
active
053874978
ABSTRACT:
This is a method for forming patterned features. The method comprises: forming a single layer of resist 12 on a substrate 10, the layer 12 having a thickness; patterning the resist by selective exposure to a first energy source 16 to modify the developing properties of portions of the resist, leaving an amount of the thickness unexposed; and developing the resist. This is also a device which comprises: a substrate; a layer of resist over the substrate; and an energy absorbing dye in the resist. Other methods and structures are also disclosed.
REFERENCES:
patent: 3647447 (1972-03-01), Gilson et al.
patent: 4370404 (1983-01-01), Tachikawa et al.
patent: 4810601 (1989-03-01), Allen et al.
patent: 5015556 (1991-05-01), Martens
patent: 5015559 (1991-05-01), Ogawa
patent: 5079131 (1992-01-01), Thackeray et al.
patent: 5094936 (1992-03-01), Misium et al.
Baik, et al., "Comparative study between gas-and liquid-phase silylation for the diffusion-enhanced silylated resist process", Journal of Vacuum Science & Technology, Part B(6), Nov./Dec. 1991, pp. 3399-3405.
F. Coopmans et al, "DESIRE: A New Route to Submicron Optical Lithography", Solid State Technology, Jun. 1987, pp. 93-99.
C. G. Roffey, Photopolymerization of Surface Coatings, John Wiley & Sons, New York, N.Y. 1982, pp. 67,126-67,136.
"Laser Development of Latent Images", IBM Technical Disclosure Bulletin, pp. 266, vol. 32, No, 7, Dec. 1989.
Pampalone, et al., "Improving Linewidth Control over Reflective Surfaces Using Heavily Dyed Resists", Journal of the Electrochemical Society, pp. 192-196, vol. 133, No. 1, Jan. 1986.
Feder, et al., "Dry Development of Photoresists", IBM Technical Disclosure Bulletin, p. 316, vol. 19, No. 1, Jun. 1979.
Hartman, et al., "Radiant cured polymer optical waveguides on printed circuit boards for photonic interconnection use", Applied Optics, vol. 28, No. 1, pp. 40, 42-47, Jan. 1, 1989.
Brunsvold, et al., "Resist technology for submicrometer optical lithography", Optical Engineering, vol. 26, No. 4, pp. 330-336, Apr. 1987.
M. J. Bowden, "Forefront of Research on Resists", Solid State Technology, pp. 73-87, Jun. 1981.
Gene E. Fuller, "Optical Lithography Status", Solid State Technology, pp. 113-118, Sep. 1987.
Makoto Nakase, "Potential of optical lithography", Optical Engineering, vol. 26, No. 4, pp. 319-324, Apr. 1987.
Burton Dana L.
Kesterson James C.
Martin Roland
Stoltz Richard A.
Texas Instruments Incorporated
LandOfFree
High resolution lithography method using hydrogen developing rea does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High resolution lithography method using hydrogen developing rea, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High resolution lithography method using hydrogen developing rea will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1109660