4. Alloys or metallic compositions
  5. Palladium base

Kensei Murakami

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Clad bonding wire for semiconductor device

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

High purity gold bonding wire for semiconductor device

Alloys or metallic compositions – Gold base
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Palladium bonding wire for semiconductor device

Alloys or metallic compositions – Palladium base
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Kensei Murakami does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Kensei Murakami, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Kensei Murakami will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-929140

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure