High performance system-on-chip discrete components using...

Details High performance system-on-chip discrete components using... High performance system-on-chip discrete components using...

2005-03-22

2005-03-22

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S613000, C438S125000

Reexamination Certificate

active

06869870

ABSTRACT:
A system and method for forming post passivation discrete components, is described. High quality discrete components are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

REFERENCES:
patent: 5055907 (1991-10-01), Jacobs
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5212403 (1993-05-01), Nakanishi et al.
patent: 5372967 (1994-12-01), Sundaram et al.
patent: 5485038 (1996-01-01), Licari et al.
patent: 5501006 (1996-03-01), Gehman, Jr. et al.
patent: 5576680 (1996-11-01), Ling
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5686764 (1997-11-01), Fulcher
patent: 6008102 (1999-12-01), Alford et al.
patent: 6051489 (2000-04-01), Young et al.
patent: 6184589 (2001-02-01), Budnaitis et al.
patent: 6303423 (2001-10-01), Lin
patent: 6456183 (2002-09-01), Basteres et al.
patent: 6459135 (2002-10-01), Basteres et al.

Affiliated with

Also associated with

Rating

High performance system-on-chip discrete components using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High performance system-on-chip discrete components using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance system-on-chip discrete components using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3401153