High-performance insulated-gate field-effect transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257384, 257385, 257387, H01L 2910, H01L 2968

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active

053979095

ABSTRACT:
An improved device fabrication method and transistor structure 36 provide shallow, heavily doped, source/drain junction regions 64 and a uniformly doped lower gate region 50 having a high concentration of dopants efficiently distributed near the gate electrode/gate interface 51. The gate, source, and drain terminals of transistor 36 may be interconnected to other neighboring or remote devices through the use of reacted refractory metal interconnect segments 98 and 100. Transistor structure 36 of the present invention may be constructed in an elevated source/drain format to include elevated source/drain junction regions 87 which may be fabricated simultaneous with a primary upper gate electrode region 88. This elevated source/drain junction feature is provided without added device processing complexity.

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Ghandhi, VLSI Fabrication Principles, John Wileys Sons, 1983, p. 324.
Pfiester et al., "A Self-Aligned Elevated Source/Drain MOSFET", IEEE Electron Device Letters, vol. 11, No. 9, Sep., 1990, pp. 365-367.

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