High performance DRAM structure employing multiple thickness gat

Static information storage and retrieval – Read/write circuit – Including level shift or pull-up circuit

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365 51, 365 63, 365226, 36523006, G11C 700

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active

060090235

ABSTRACT:
A DRAM device having improved performance of peripheral circuitry is described. The performance is improved by selectively having MOS transistors with a thinner gate oxide in peripheral circuits having a lower voltage applied to their gate electrodes. The DRAM device will maintain reliability by having MOS transistors with a thicker gate oxide in the memory cells and selected peripheral circuitry that are subjected to a higher voltage at their gate electrodes. Further this invention describes methods of fabricating the DRAM device with selectively placed multiple gate oxide thickness.

REFERENCES:
patent: 4525811 (1985-07-01), Masuoka
patent: 5057449 (1991-10-01), Lowrey et al.
patent: 5083172 (1992-01-01), Kiyono
patent: 5251172 (1993-10-01), Yamauchi
patent: 5293336 (1994-03-01), Ishii et al.
patent: 5327002 (1994-07-01), Motoyoshi
patent: 5426065 (1995-06-01), Chan et al.
patent: 5497021 (1996-03-01), Tada
patent: 5502009 (1996-03-01), Lin
patent: 5526313 (1996-06-01), Etoh et al.
patent: 5576226 (1996-11-01), Hwang
patent: 5595922 (1997-01-01), Tigelaar et al.
patent: 5672521 (1997-09-01), Barsan et al.
patent: 5703392 (1997-12-01), Guo
patent: 5740113 (1998-04-01), Kaneko
patent: 5825696 (1998-10-01), Hidaka et al.
patent: 5872737 (1999-02-01), Tsuruda et al.
patent: 5875148 (1999-02-01), Tanaka et al.
"Embedded DRAM Technologies" H. Ishiuchi et al, IEDM Technical Digest, 1997, p. 33-36.

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