High flow vacuum chamber including equipment modules such as a p

Details High flow vacuum chamber including equipment modules such as a p High flow vacuum chamber including equipment modules such as a p

1996-06-05

1999-09-07

Russel, Jeffrey E.

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

118723R, 118725, 118728, 118733, 156345, 216 67, 216 68, 216 69, 279128, 427569, 427570, 427571, 427573, 427575, H01L 21306, H01L 213065, H05H 100

Patent

active

059487046

ABSTRACT:
A vacuum processing chamber having a substrate support removably mounted therein. The chamber includes an opening in a sidewall thereof and the opening is large enough to allow the substrate support to be removed from the chamber through the opening. A modular mounting arrangement extends through the opening and removably supports the substrate support in the interior of the chamber at a position located inwardly of an inner sidewall of the chamber. The mounting arrangement includes a mounting flange and a support arm. The mounting flange is attached to an exterior surface of the chamber and the support arm extends between the substrate support and the mounting flange. The chamber includes a single vacuum port in a central portion of an endwall of the chamber spaced from the substrate support. The vacuum port is connected to a vacuum pump which removes gases from the interior of the chamber and maintains the chamber at a pressure below atmospheric pressure. The substrate support is easy to service or replace since it can be removed through a sidewall of the chamber. The sidewall mounted substrate support also allows a large vacuum port to be located in the endwall of the chamber thus allowing high flow to be achieved by connecting the vacuum port a large capacity vacuum pump. The chamber also includes a modular liner, a modular plasma generating source and a modular vacuum pumping arrangement, each of which can be replaced with interchangeable equipment.

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