High-density patterning

Details High-density patterning High-density patterning

2011-08-09

2011-08-09

Deo, Duy-Vu N (Department: 1713)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S670000, C438S671000

Reexamination Certificate

active

07994052

ABSTRACT:
Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

REFERENCES:
patent: 7273812 (2007-09-01), Kim et al.
patent: 2003/0203284 (2003-10-01), Iriguchi et al.

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