High-density patterning

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S670000, C438S671000

Reexamination Certificate

active

07994052

ABSTRACT:
Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

REFERENCES:
patent: 7273812 (2007-09-01), Kim et al.
patent: 2003/0203284 (2003-10-01), Iriguchi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-density patterning does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density patterning, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density patterning will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2658486

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.