Etching a substrate: processes – Gas phase etching of substrate
Reexamination Certificate
2011-07-19
2011-07-19
Ahmed, Shamim (Department: 1713)
Etching a substrate: processes
Gas phase etching of substrate
C216S011000, C216S059000, C216S067000, C216S079000, C438S706000, C438S710000, C438S714000, C438S733000
Reexamination Certificate
active
07981305
ABSTRACT:
A method for forming high density emission elements and field emission displays formed according to the method. Oxygen and a silicon etchant are introduced into a plasma etching chamber containing a silicon substrate. The oxygen reacts with the silicon surface to form regions of silicon dioxide, while the silicon etchant etches the silicon to form the emission elements. The silicon dioxide regions mask the underlying silicon during the silicon etch process. High density and high aspect ratio emission elements are formed without using photolithographic processes. The emission elements formed according to the present invention provide a more uniform emission of electrons. Further, a display incorporating emission elements formed according to the present invention provides increased brightness. The reliability of the display is increased due to the use of a plurality of emission elements to supply electrons for stimulating the phosphor substrate material to produce the image.
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Gibson, Jr. Gerald W.
Koh Seong Jin
Agere Systems Inc.
Ahmed Shamim
LandOfFree
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