High-density 3-dimensional resistors

Details High-density 3-dimensional resistors High-density 3-dimensional resistors

2006-10-03

2009-02-10

Pizarro, Marcos D. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S597000, C257SE21579

Reexamination Certificate

active

07488682

ABSTRACT:
Interconnect, i.e., BEOL structures comprising at least one thin film resistor that is located at the same level as that of a neighboring conductive interconnect are provided. The present invention also provides a method of fabricating such interconnect structures utilizing processing steps that are compatible with current interconnect processing. Moreover, the inventive method of the present invention provides better technology extendibility in terms of higher density than prior art schemes.

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patent: 2004/0027234 (2004-02-01), Hashimoto et al.
patent: 2006/0012052 (2006-01-01), McDevitt et al.
patent: 2006/0163730 (2006-07-01), Matsumoto et al.
patent: 2006/0192286 (2006-08-01), Kanamura
patent: 2007/0040276 (2007-02-01), Yang et al.

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