High current hermetic package having a lead extending through th

Details High current hermetic package having a lead extending through th High current hermetic package having a lead extending through th

1989-07-03

1991-07-02

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 74, 174 524, 174 525, 361392, H01L 3902, H01L 2302, H01L 2312, H01L 2348

Patent

active

050289870

ABSTRACT:
A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.

REFERENCES:
patent: 3218524 (1965-11-01), Reintgen et al.
patent: 3576474 (1971-04-01), Huber et al.
patent: 3740619 (1973-06-01), Rosvold
patent: 3919709 (1975-11-01), Koenig
patent: 3972062 (1976-07-01), Hopp
patent: 4070688 (1978-01-01), Wislocky
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4614836 (1986-09-01), Carpenter et al.
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4845545 (1989-07-01), Abramowitz et al.
`Via Joint with Reduced Thermal Gradients`, M. D. Reeber, IBM Tech. Disc. Bulletin, vol. 22, No. 2, Jul. '79, pp. 563-564.
Denning, Richard, "Improved Contact Means for Multi-Emitter Power Transistors", RCA Technical Notes, TN No. 851, mailed Oct. 16, 1969, pp. 1-3.

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