HID land grid array packaged device having electrical and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S432000, C257S434000, C257S435000, C257S668000, C257S678000, C257S711000, C257S774000, C257S700000

Reexamination Certificate

active

06707124

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to the field of packaged integrated circuit devices. More specifically, the present invention relates to a high density interconnect land grid array package (HDIP) having electrical and optical interconnects.


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