4. Semiconductor device manufacturing: process
  5. Including control responsive to sensed condition
  6. Interconnecting plural devices on semiconductor substrate

David N. Walter

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Controlling flip-chip techniques for concurrent ball bonds...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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HDI land grid array packaged device having electrical and...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate

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HID land grid array packaged device having electrical and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Two-metal layer ball grid array and chip scale package...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2107006

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