4. Metal fusion bonding
  5. Process
  6. Repairing, restoring, or renewing product for reuse

Garrett I. Kurogi

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Hermetically self-sealing flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Solid state microwave integrated circuit RF insulator-encapsulat

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent

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