Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1998-11-17
2000-09-12
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257704, 257783, 257710, 257712, H01L 2310, H01L 2334, H01L 2312
Patent
active
061181773
ABSTRACT:
A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained. A second substrate (which may be a motherboard, system board, or other printed circuit board) has a plurality of terminal pads. The terminal pads of the second substrate are connected to the terminal pads of the second surface of the first substrate. In an alternative (direct chip attach) configuration, the flip chip device and the heatspreader may be directly connected to a printed circuit board, which may be a motherboard or other system board.
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Lischner David
Nika Raymond J.
Ronemus James Robert
Clark Jhihan B
Hardy David
Koffs Steven E.
Lucent Technologies - Inc.
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