4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

James Robert Ronemus

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Heatspreader for a flip chip device, and method for connecting t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Heatspreader for a flip chip device, and method for...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-212224

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