Heater assembly for manufacturing a semiconductor device

Details Heater assembly for manufacturing a semiconductor device Heater assembly for manufacturing a semiconductor device

2005-01-04

2005-01-04

Paik, Sang Y. (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000, C219S544000

Reexamination Certificate

active

06838645

ABSTRACT:
A heater assembly that is capable of uniformly heating a wafer in an apparatus for manufacturing a semiconductor device is provided. The heater assembly preferably includes a susceptor configured to support a substrate (wafer). A plurality of heaters can be disposed under the susceptor to heat the wafer. A support is preferably disposed below the heaters to support the heaters, and a power supply provides an electric current to operate the heaters. The support can include a heat-shielding portion that restricts heat conduction between the heaters. The heat-shielding portion preferably comprises heat-resistant material arranged in a groove formed on the support. The heat-shielding portion also preferably supports adjacent peripheral portions of the heaters. Electrical current provided to the heaters is preferably controlled such that the temperature of the heaters are operated in a range of about 390° C. to 420° C. Alternatively, a single or multiple ring-shaped heaters having an internal radiating space can be provided below a peripheral portion of the susceptor to uniformly heat the wafer.

REFERENCES:
patent: 4981815 (1991-01-01), Kakoschke
patent: 5059770 (1991-10-01), Mahawili
patent: 6032211 (2000-02-01), Kewitt

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