Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-01-04
2005-01-04
Paik, Sang Y. (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C118S724000, C219S544000
Reexamination Certificate
active
06838645
ABSTRACT:
A heater assembly that is capable of uniformly heating a wafer in an apparatus for manufacturing a semiconductor device is provided. The heater assembly preferably includes a susceptor configured to support a substrate (wafer). A plurality of heaters can be disposed under the susceptor to heat the wafer. A support is preferably disposed below the heaters to support the heaters, and a power supply provides an electric current to operate the heaters. The support can include a heat-shielding portion that restricts heat conduction between the heaters. The heat-shielding portion preferably comprises heat-resistant material arranged in a groove formed on the support. The heat-shielding portion also preferably supports adjacent peripheral portions of the heaters. Electrical current provided to the heaters is preferably controlled such that the temperature of the heaters are operated in a range of about 390° C. to 420° C. Alternatively, a single or multiple ring-shaped heaters having an internal radiating space can be provided below a peripheral portion of the susceptor to uniformly heat the wafer.
REFERENCES:
patent: 4981815 (1991-01-01), Kakoschke
patent: 5059770 (1991-10-01), Mahawili
patent: 6032211 (2000-02-01), Kewitt
Choi Chul-Hwan
Jang Sung-Hwan
Jeon Jin-Ho
Kim Kyung-Tae
Kim Yong-Gab
Marger & Johnson & McCollom, P.C.
Paik Sang Y.
Samsung Electronics Co,. Ltd.
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