Heat treatment apparatus and method of semiconductor wafer

Details Heat treatment apparatus and method of semiconductor wafer Heat treatment apparatus and method of semiconductor wafer

2006-08-22

2006-08-22

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000, C219S483000

Reexamination Certificate

active

07094994

ABSTRACT:
A semiconductor wafer heat treatment apparatus and method, which can carry out a heat treatment to suppress variations in line widths within a surface on a semiconductor wafer and the like, includes: a heating plate for heating a semiconductor wafer to a predetermined temperature; a temperature measuring unit for measuring temperatures when heating the semiconductor wafer or a semiconductor wafer equivalent placed on the heating plate, at portions divided into a plurality of regions; and a controller for controlling the temperatures of the semiconductor wafer, and based on the temperature measurement result of the temperature measuring unit, the controller controls the temperature in heating the semiconductor wafer, for each of the plurality of regions. In cooling after the heating process, based on the temperature measurement result, the controller controls the temperature in cooling the semiconductor wafer, for each of the plurality of regions.

REFERENCES:
patent: 5294778 (1994-03-01), Carman et al.
patent: 5580607 (1996-12-01), Takekuma et al.
patent: 6311091 (2001-10-01), Yamahira
patent: 6402509 (2002-06-01), Ookura et al.

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