4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Express Packaging Systems, Inc.

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Heat spreader with a placement recess and bottom saw-teeth for c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Low-cost surface-mount compatible land-grid array (LGA) chip sca

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Single-core two-side substrate with u-strip and co-planar signal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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