Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Inventor
active
Exchange 2.5″ to 3.5″ redundant array of...
Heat spreader and package structure utilizing the same
Heat spreader and package structure utilizing the same
Heat spreader and package structure utilizing the same
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Profile ID: LFUS-PAI-P-2400359