Heat sink with preattached thermal interface material and...

Details Heat sink with preattached thermal interface material and... Heat sink with preattached thermal interface material and...

2003-03-31

2008-08-26

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21519

Reexamination Certificate

active

07416922

ABSTRACT:
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.

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