Heat-resistant photoresist composition, photosensitive substrate

Details Heat-resistant photoresist composition, photosensitive substrate Heat-resistant photoresist composition, photosensitive substrate

1996-12-20

1998-12-22

Dote, Janis L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

4302701, 4302831, 430326, 430330, 430906, 430920, G03F 740, G03F 7004

Patent

active

058517367

ABSTRACT:
A heat-resistant photoresist composition comprising a polyimide precursor having a structural unit represented by formula (I): ##STR1## wherein the arrows, R.sub.1, and R.sub.2 are the same as defined hereinbefore, and a compound which becomes basic upon irradiation with actinic rays, for example, represented by formula (II): ##STR2## wherein R.sub.3 to R.sub.6 and X.sub.1 to X.sub.4 are the same as defined hereinbefore,

REFERENCES:
patent: 3890152 (1975-06-01), Ruckert et al.
patent: 3901710 (1975-08-01), Ranz et al.
patent: 4181531 (1980-01-01), Pilz
patent: 4242437 (1980-12-01), Rohloff
patent: 4243741 (1981-01-01), Abele et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4358529 (1982-11-01), Abele
patent: 4416973 (1983-11-01), Goff
patent: 4430918 (1984-02-01), Goff
patent: 4491628 (1985-01-01), Ito et al.
patent: 4565767 (1986-01-01), Kataoka et al.
patent: 4604340 (1986-08-01), Grossa
patent: 4880772 (1989-11-01), Moreau et al.
patent: 4927736 (1990-05-01), Mueller et al.
patent: 5081000 (1992-01-01), Kuehn et al.
patent: 5114826 (1992-05-01), Kwong et al.
patent: 5206117 (1993-04-01), Labadie et al.
patent: 5326792 (1994-07-01), Masaki et al.
patent: 5348835 (1994-09-01), Oba et al.
patent: 5449584 (1995-09-01), Banba et al.
patent: 5665523 (1997-09-01), Omote et al.
Yamaoko et al., "Photochemical Behavior . . . ", Journal of Imaging Science, vol. 34, pp. 50-54 (Mar. 1990).
Polymer Preprints, Japan, vol. 39, No. 8 (1990).
Concise Explanation of Relevancy for JP-A-49-60733.
Concise Explanation of Relevancy for JP-A-58-223147.

Affiliated with

Also associated with

Rating

Heat-resistant photoresist composition, photosensitive substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-resistant photoresist composition, photosensitive substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-resistant photoresist composition, photosensitive substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2045351