Ground strap for suppressing stiction during MEMS fabrication

Details Ground strap for suppressing stiction during MEMS fabrication Ground strap for suppressing stiction during MEMS fabrication

2007-06-28

2009-06-09

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S051000, C438S048000, C438S053000, C438S706000, C438S739000

Reexamination Certificate

active

07544531

ABSTRACT:
To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches around their contact structures. After the isolation trenches have been formed, the ground strap is transformed into a non-conductive material to complete the electrical isolation of the conductive structures. An etch mask formed on top of the ground strap prevents etching of the ground strap during the formation of the trenches. Depending on the etching process, the ground strap may be formed as a bridge that suspends above the isolation trench or as a column that extends down to the bottom of the isolation trench.

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patent: 2006/0207087 (2006-09-01), Jafri et al.
patent: 2006/0214746 (2006-09-01), Nakamura

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