4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Jeremias P. Libres

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Bellows container packaging system and method

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Grooved substrates for uniform underfilling solder ball...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Grooved substrates for uniform underfilling solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Heatsink-substrate-spacer structure for an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Low profile, chip-scale package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-827530

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