4. Surgery
  5. Means for introducing or removing material from body for...
  6. Treating material introduced into or removed from body...

Mary C. Miller

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Grooved substrates for uniform underfilling solder ball...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Grooved substrates for uniform underfilling solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Hypodermic syringe

Surgery – Means for introducing or removing material from body for... – Treating material introduced into or removed from body...
Patent

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Method and system to combine keyword and natural language...

Data processing: database and file management or data structures – Database and file access – Record – file – and data search and comparisons
Reexamination Certificate

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Profile ID: LFUS-PAI-P-984566

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