Gold CMP composition and method

Details Gold CMP composition and method Gold CMP composition and method

2008-05-06

2008-05-06

Norton, Nadine G. (Department: 1792)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C438S692000, C438S689000, C438S690000, C438S693000, C438S687000, C252S079000

Reexamination Certificate

active

07368066

ABSTRACT:
The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.

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