Semiconductor chip with flexible contacts at a face

Details Semiconductor chip with flexible contacts at a face Semiconductor chip with flexible contacts at a face

2008-05-20

2008-05-20

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE23021

Reexamination Certificate

active

07375434

ABSTRACT:
The present invention relates to a semiconductor chip comprising a semiconductor element, at least a conducting line and a contact area being arranged on the semiconductor element, the conducting line being connected with the contact area, the contact area being disposed for contacting another electrical contact, characterised in that the semiconductor element comprises at a face of the semiconductor element a flexible arm formed out of the semiconductor element and the contacting area being arranged on the arm.

REFERENCES:
patent: 5260596 (1993-11-01), Dunn et al.
patent: 5656553 (1997-08-01), Leas et al.
patent: 5723894 (1998-03-01), Ueno et al.
patent: 6439898 (2002-08-01), Chua et al.
patent: 6939735 (2005-09-01), Smith et al.

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