Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Patent
1995-09-25
1998-05-12
Dang, Trung
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Multiple layers
438763, 438947, 438952, 438950, H01L 2131
Patent
active
057504423
ABSTRACT:
Germanium is employed as an antireflective coating material for use in active area lithography and gate area lithography steps in the formation of a semiconductor integrated circuit. A germanium layer is deposited over an active area nitride layer or over a gate area nitride layer, and a photoresist layer is then formed on the germanium layer. The photoresist layer is than exposed and developed. During exposure, the germanium layer substantially reduces reflection from the underlying nitride layer, thereby relieving the dependency of exposure energy and resulting line width on the underlying nitride layer thickness. Germanium-silicon may also be employed as the antireflective layer.
REFERENCES:
patent: 5378659 (1995-01-01), Roman et al.
patent: 5580701 (1996-12-01), Lur et al.
patent: 5656128 (1997-08-01), Hashimoto et al.
Dang Trung
Micro)n Technology, Inc.
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