Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With mechanical mask – shield or shutter for shielding workpiece
Reexamination Certificate
2008-01-28
2011-12-27
Chen, Keath (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With mechanical mask, shield or shutter for shielding workpiece
C156S345430, C216S067000
Reexamination Certificate
active
08083890
ABSTRACT:
The various embodiments provide apparatus and methods of removal of unwanted deposits near the bevel edge of substrates to improve process yield. The embodiments provide apparatus and methods with center and edge gas feeds as additional process knobs for selecting a most suitable bevel edge etching processes to push the edge exclusion zone further outward towards the edge of substrates. Further the embodiments provide apparatus and methods with tuning gas(es) to change the etching profile at the bevel edge and using a combination of center and edge gas feeds to flow process and tuning gases into the chamber. Both the usage of tuning gas and location of gas feed(s) affect the etching characteristics at bevel edge. Total gas flow, gap distance between the gas delivery plate and substrate surface, pressure, and types of process gas(es) are also found to affect bevel edge etching profiles.
REFERENCES:
patent: 7094698 (2006-08-01), Kang
patent: 2004/0079728 (2004-04-01), Mungekar et al.
patent: 2005/0173067 (2005-08-01), Lim
patent: 2006/0086461 (2006-04-01), Inada et al.
patent: 2007/0068900 (2007-03-01), Kim et al.
patent: 7-142449 (1995-02-01), None
Jeon et al., “Cleaning of wafer edge, bevel and back-side with a torus-shaped capacitively coupled plasma”, Plasma Sources Science and Technology, Inst. of Physics Publishing, Bristol, GB, vol. 11, No. 4, Nov. 1, 2002, pp. 520-524, XP020069982, ISSN: 0963-0252, DOI: 10.1088/0963-0252/11/4/319.
Bailey III Andrew D.
Fang Tong
Kim Yun-sang
Rigoutat Olivier
Stojakovic George
Chen Keath
Lam Research Corporation
Martine Penilla Group LLP
LandOfFree
Gas modulation to control edge exclusion in a bevel edge... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Gas modulation to control edge exclusion in a bevel edge..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gas modulation to control edge exclusion in a bevel edge... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4316128