Gas etching method and apparatus

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

204192E, 204298, 204164, 250531, C23F 102, C23C 1500, B01K 100

Patent

active

041606906

ABSTRACT:
A gas etching apparatus comprising an etching gas-producing chamber; means for introducing into said chamber a mixture of a gas containing fluorine atoms and a gas containing oxygen atoms; means for activating the gas mixture received in the etching gas-producing chamber; an etching chamber provided in a region located apart from the etching gas-producing chamber and free from the electric field produced by the activating means; and an etching gas-conducting pipe means for establishing communication between the etching gas-producing chamber and etching chamber, the improvement being that the etching gas-conducting pipe means is designed to satisfy the following formula:

REFERENCES:
patent: 4065369 (1977-12-01), Ogawa et al.
patent: 4123663 (1978-10-01), Horiike

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