Gas distribution head for plasma deposition and etch systems

Details Gas distribution head for plasma deposition and etch systems Gas distribution head for plasma deposition and etch systems

1992-06-16

1993-11-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 134 1, 118723R, 118 501, B44C 122, B08B 312, C23C 1600

Patent

active

052661539

ABSTRACT:
A gas distribution head for plasma deposition and etch systems includes an electrically conductive casing surrounding a plenum chamber. The casing includes a gas inlet and a gas outlet in the form of apertures through the casing. An electrically conductive electrode is positioned within the casing with respect to the interior surfaces of the casing such that a plasma forms between the electrode and the casing upon application of an electrical potential between them. A reactive gas is injected between the two electrodes which is struck to form a plasma for cleaning the inner surfaces of the plasma chamber of undesirable particulates and residues.

REFERENCES:
patent: 5006192 (1991-04-01), Deguchi
patent: 5084125 (1992-01-01), Aoi

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