Process for forming planarized, air-bridge interconnects on a se

Details Process for forming planarized, air-bridge interconnects on a se Process for forming planarized, air-bridge interconnects on a se

1991-01-28

1992-12-15

Quach, T. N.

Fishing, trapping, and vermin destroying

437183, 437195, 437228, 148DIG20, 257750, H01L 21283

Patent

active

051717131

ABSTRACT:
A process for fabricating a integrated circuit (IC), including a plurality of devices coupled together by a system of metal interconnects disposed above a semiconductor substrate comprises the steps of forming a plurality of conductive pedestals on the surface of the substrate. A portion of the pedestals form electrical contacts to the devices, wherein the height of the pedestals is higher than any feature of the substrate. After a polyimide layer is deposited on the substrate to a thickness which covers the pedestals, an etching step is performed until the top surface of the pedestals is coplanar with the polyimide layer. A set of metal interconnect lines is then formed over the polyimide and pedestals to form electrical connections to selected ones of the pedestal contacts.

REFERENCES:
patent: 3657029 (1972-04-01), Fuller
patent: 4614021 (1986-09-01), Hulseweh
patent: 4866008 (1989-09-01), Brighton et al.
patent: 5000818 (1991-03-01), Thomas et al.
patent: 5018256 (1991-05-01), Hornbeck

Affiliated with

Also associated with

Rating

Process for forming planarized, air-bridge interconnects on a se does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming planarized, air-bridge interconnects on a se, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming planarized, air-bridge interconnects on a se will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2092701