Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent
1997-09-30
2000-08-01
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
438632, 438633, 438645, 438646, 438692, 438760, 438698, H01L 21302
Patent
active
060966548
ABSTRACT:
Improved gap fill of narrow spaces is achieved by using a doped silicate glass having a dopant concentration in a bottom portion thereof which is greater than an amount which causes surface crystal growth and in an upper portion thereof having a lower dopant concentration such that the overall dopant concentration of the doped silicate glass is below that which causes surface crystal growth.
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IBM Technical Disclosure Bulletin, vol. 31, No. 11, dated Apr. 1989 entitled Automatic Unlimited Dynamic Memory Relocation.
Ilg Matthias
Kirchhoff Markus M.
Braden Stanton C.
Goudreau George
Powell William
Siemens Aktiengesellschaft
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