Full area temperature controlled electrostatic chuck and...

Details Full area temperature controlled electrostatic chuck and... Full area temperature controlled electrostatic chuck and...

2005-02-08

2005-02-08

Sircus, Brian (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

06853533

ABSTRACT:
A semiconductor wafer support assembly and method of fabricating the same are provided. In one embodiment, the method and resulting assembly include attaching a pedestal joining-ring to a bottom surface of a ceramic puck. Low temperature brazing a composite cooling plate structure to the bottom surface of the ceramic puck, where the pedestal joining-ring circumscribes the composite cooling plate structure. Thereafter, a pedestal is electron-beam welded to the pedestal joining-ring.

REFERENCES:
patent: 5228501 (1993-07-01), Tepman et al.
patent: 5511799 (1996-04-01), Davenport
patent: 5535090 (1996-07-01), Sherman
patent: 5656093 (1997-08-01), Burkhart et al.
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5861086 (1999-01-01), Khurana et al.

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