Friction sensor for polishing system

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S285000, C451S288000

Reexamination Certificate

active

07727049

ABSTRACT:
A system. method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

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