Frequency monitoring to detect plasma process abnormality

Details Frequency monitoring to detect plasma process abnormality Frequency monitoring to detect plasma process abnormality

2011-03-08

2011-03-08

Mullen, Thomas J (Department: 2612)

Communications: electrical

Condition responsive indicating system

Specific condition

C315S111210, C340S540000, C340S679000

Reexamination Certificate

active

07902991

ABSTRACT:
Abnormal conditions within an RF-powered plasma process chamber are detected by detecting whether the frequency of a variable-frequency RF power supply moves outside established lower and upper limits. In a first aspect, a first pair of lower and upper limits are established as a function of the frequency of the power supply sampled after a new process step begins or after a sample control signal changes state. In a second aspect, a second pair of lower and upper limits are not adapted to the frequency of the power supply. Both aspects preferably are used together to detect different occurrences of abnormal conditions.

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