4. Error detection/correction and fault detection/recovery
  5. Pulse or data error handling
  6. Digital data error correction

Gerald E. Linden

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Bumping electronic components using transfer substrates

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Configurable universal serial bus (USB) controller...

Electrical computers and digital data processing systems: input/ – Input/output data processing – Peripheral adapting
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DRAM enhanced processor

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
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Dual interface inlays

Registers – Records – Conductive
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Efficient fast pulsed laser or light-emitting diode driver

Electricity: power supply or regulation systems – Output level responsive – Using a three or more terminal semiconductive device as the...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2047230

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