Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2007-12-25
2007-12-25
Ngô, Ngân V. (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S151000, C438S197000, C977S936000, C257SE21483
Reexamination Certificate
active
10819790
ABSTRACT:
A nano-electrode or nano-wire may be etched centrally to form a gap between nano-electrode portions. The portions may ultimately constitute a single electron transistor. The source and drain formed from the electrode portions are self-aligned with one another. Using spacer technology, the gap between the electrodes may be made very small.
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Berlin Andrew A.
Bohr Mark
Dubin Valery M.
Sivakumar Swaminathan
Intel Corporation
Ngo Ngan V.
Trop Pruner & Hu P.C.
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