Forming low k dielectric layers

Details Forming low k dielectric layers Forming low k dielectric layers

2007-04-17

2007-04-17

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Reexamination Certificate

active

10298225

ABSTRACT:
A low k dielectric layer is formed by depositing an unset dielectric layer on a substrate, the dielectric layer including Silicon, Carbon and Oxygen. The surface of the dielectric layer exposed to an activated gas to form a semi-permeable skin on or of the surface of the layer. The layer is then cured to render at least part of the layer porous.

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