Forming a circuit pattern in a metallic tape by electrical disch

Details Forming a circuit pattern in a metallic tape by electrical disch Forming a circuit pattern in a metallic tape by electrical disch

1987-04-13

1988-04-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29827, 156643, 156645, 156650, 156654, 1562722, 156345, 156901, 2041295, 20412955, 219 69E, 219 69M, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047356782

ABSTRACT:
The present invention is directed to the process of forming a circuit pattern in a strip of metallic tape with an electrical discharge machining apparatus having an electrode and a pool of dielectric material. The electrode, having a negative image of the circuit pattern cut into a first end thereof, is submerged in the dielectric material. By controlling the pulsing of direct current across the gap between the electrode and the strip of metallic material for a period of time, a spark discharging across the gap causes small quantities of the metallic foil to be removed so as to cut the circuit pattern.

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"TAB Technology Tackles High Density Interconnections", by Tom Dixon, Dec. 1984, vol. of Electronic Packaging & Production at pp. 34-39.
"Electrical Discharge Machining (EDM)", by John F. Kahles, Metals Handbook, vol. 3, pp. 227 through 233.

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