Brian E. O'Donnelly

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Electronic package with stress relief channel

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
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Forming a circuit pattern in a metallic tape by electrical disch

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Semiconductor die attach system

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Semiconductor die attach system

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Profile ID: LFUS-PAI-P-888591

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