Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-24
2005-05-24
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE23021
Reexamination Certificate
active
06897142
ABSTRACT:
A method of forming a solder ball includes the steps of forming an electrode pad on a substrate, forming an insulating layer having a first opening at a position of the electrode pad, filling the first opening with solder paste that include solder and first resin, and applying a heating process to the solder paste so as to form a solder ball on the electrode pad and to form a cured resin member of the first resin across a border between the electrode pad and the substrate.
REFERENCES:
patent: 5088189 (1992-02-01), Brown
patent: 6028011 (2000-02-01), Takase et al.
patent: 20010008310 (2001-07-01), Sakuyama et al.
patent: 20020195170 (2002-12-01), Nomura et al.
patent: 869704 (1998-10-01), None
patent: 08174264 (1996-07-01), None
patent: 09172035 (1997-06-01), None
patent: 11320176 (1999-11-01), None
patent: 2001007158 (2001-01-01), None
Hirobumi Nakamura, “Solder Paste,” Japan Patent Office, Sep. 1996, English translation of JP 08-174264 A.*
S. Sakuyama et al., “Solder Paste,” Japan Patent Office, Nov. 1999, English translation of JP 11-320176 A.*
URL: Fujitsu Co., Ltd., “Fujitsu Develops Advanced Printing Bump Technology,” [online], Dec. 12, 2001, InternetURL:http//pr.fujitsu.com/jp
ews/2001/12/12-1.html.
S. Sakuyama, et al., “Solder Bumping Technology for Wafer-scale Packaging”, 7thSymposium on “Microjoining and Assembly Technology in Electronics”, Micro-Contact Research Committee, Feb. 1, 2001, p. 285-290, (English Abstract).
Fujimori Joji
Yamaguchi Ichiro
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