Formation of a negative resist pattern utilize water-soluble pol

Details Formation of a negative resist pattern utilize water-soluble pol Formation of a negative resist pattern utilize water-soluble pol

1989-03-13

1991-05-21

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430176, 430330, G03F 730, G03F 740

Patent

active

050174614

ABSTRACT:
A process for the formation of a negative resist pattern, comprising preparing a mixture consisting of water-soluble polymeric material having at least one hydroxyl group with a photoacid generator capable of releasing an acid upon radiation exposure, coating a solution of the resist material onto a substrate to form a resist layer, exposing layer to patterned radiation, heating the exposed resist layer in the presence of an acid as a catalyst to remove water, and developing resist layer with water to remove unexposed areas to form a resist pattern on the substrate.

REFERENCES:
patent: 4414059 (1983-11-01), Blum et al.
patent: 4537854 (1985-08-01), Crivello
patent: 4610952 (1986-09-01), Crivello
patent: 4657844 (1987-04-01), Shu et al.
patent: 4659650 (1987-04-01), Moritz et al.
patent: 4883740 (1989-11-01), Schwalm et al.

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