Follow-up system for etch process monitoring

Details Follow-up system for etch process monitoring Follow-up system for etch process monitoring

1992-01-15

1993-06-29

Evans, F. L.

Optics: measuring and testing

By configuration comparison

With photosensitive film or plate

356316, 250372, G01B 1102

Patent

active

052239144

ABSTRACT:
A follow-up system for monitoring the etching process in RIE equipment. A spectrometer is used in an interferometric mode for accurate thickness measuring to produce high-resolution and reproducible patterns in a layer of etchable material formed on a substrate.

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