Coating apparatus – Gas or vapor deposition – With treating means
Patent
1994-04-05
1997-11-11
Niebling, John
Coating apparatus
Gas or vapor deposition
With treating means
156345, C23C 1600
Patent
active
056859147
ABSTRACT:
In one aspect, the invention is embodied in a plasma reactor for processing a semiconductor wafer, the reactor having a pedestal focus ring surrounding the periphery of the wafer for reducing the process etch rate near the wafer periphery, and plural openings through the pedestal focus ring which permit passage therethrough of particulate contamination, thereby reducing accumulation of particulate contamination near the wafer periphery. In another aspect, in order to reduce corrosive wear of the chamber walls, a removable gas distribution focus ring shields the side walls of the plasma reactor from reactive gases associated with processing of the semiconductor wafer.
REFERENCES:
patent: 4512283 (1985-04-01), Bonifield et al.
patent: 5213658 (1993-05-01), Ishida
patent: 5246532 (1993-09-01), Ishida
patent: 5298465 (1994-03-01), Levy
patent: 5423918 (1995-06-01), Gupta et al.
Hills Graham W.
Ryan Robert E.
Su Yuh-Jia
Tanase Yoshiaki
Applied Materials Inc.
Chang Joni Y.
Niebling John
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